GENEVA, Sept. 18 -- SHIN-ETSU POLYMER CO., LTD. filed a patent application (JP2025/008075) for “DICING FRAME”. With publication no. WO/2026/186040, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H01L 21/301
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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