INTERNATIONAL PATENT: DIC CORPORATION, ＤＩＣ株式会社 FILES APPLICATION FOR "TWO-PART CURABLE ADHESIVE, LAMINATE AND RECYCLING METHOD"

GENEVA, April 19 -- DIC CORPORATION (35-58, Sakashita 3-chome, Itabashi-ku, Tokyo1748520), ＤＩＣ株式会社 (東京都板橋区坂下三丁目３５番５８号) filed a patent application (PCT/JP2025/033702) for "TWO-PART CURABLE ADHESIVE, LAMINATE, AND RECYCLING METHOD" on Sep 25, 2025. With publication no. WO/2026/079137, the details related to the patent application was published on Apr 16, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): TAKEDA Miho (c/o DIC Corpor...