INTERNATIONAL PATENT: DIC CORPORATION, ＤＩＣ株式会社 FILES APPLICATION FOR "METHOD FOR MANUFACTURING HOLLOW FIBER MEMBRANE ELEMENT, HOLLOW FIBER MEMBRANE ELEMENT AND HOLLOW FIBER MEMBRANE MODULE"

GENEVA, May 11 -- DIC CORPORATION (35-58, Sakashita 3-chome, Itabashi-ku, Tokyo1748520), ＤＩＣ株式会社 (東京都板橋区坂下３丁目３５番５８号) filed a patent application (PCT/JP2025/037334) for "METHOD FOR MANUFACTURING HOLLOW FIBER MEMBRANE ELEMENT, HOLLOW FIBER MEMBRANE ELEMENT, AND HOLLOW FIBER MEMBRANE MODULE" on Oct 23, 2025. With publication no. WO/2026/094775, the details related to the patent application was published on May 07, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Or...