GENEVA, March 10 -- DIC CORPORATION (35-58, Sakashita 3-chome, Itabashi-ku, Tokyo1748520), ＤＩＣ株式会社 (東京都板橋区坂下三丁目３５番５８号) filed a patent application (PCT/JP2025/028057) for "METHOD FOR DISMANTLING BONDED BODY" on Aug 07, 2025. With publication no. WO/2026/048464, the details related to the patent application was published on Mar 05, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): OTSU Masato (c/o DIC Corporation, Central Research...