INTERNATIONAL PATENT: DIC CORPORATION, ＤＩＣ株式会社 FILES APPLICATION FOR "HOLLOW FIBER MEMBRANE ELEMENT, HOLLOW FIBER MEMBRANE MODULE, DEGASSING METHOD AND GAS ADDITION METHOD"

GENEVA, March 17 -- DIC CORPORATION (35-58, Sakashita 3-chome, Itabashi-ku, Tokyo1748520), ＤＩＣ株式会社 (東京都板橋区坂下３丁目３５番５８号) filed a patent application (PCT/JP2025/028630) for "HOLLOW FIBER MEMBRANE ELEMENT, HOLLOW FIBER MEMBRANE MODULE, DEGASSING METHOD, AND GAS ADDITION METHOD" on Aug 13, 2025. With publication no. WO/2026/053702, the details related to the patent application was published on Mar 12, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIP...