GENEVA, March 24 -- DIC CORPORATION (35-58, Sakashita 3-chome, Itabashi-ku, Tokyo1748520), ＤＩＣ株式会社 (東京都板橋区坂下三丁目３５番５８号) filed a patent application (PCT/JP2025/027099) for "EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF" on Jul 31, 2025. With publication no. WO/2026/058596, the details related to the patent application was published on Mar 19, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): YAMADA Shunsuke (c/o DIC Corporatio...