GENEVA, Sept. 7 -- QUALCOMM INCORPORATED filed a patent application (US2026/014933) for “DEEP TRENCH CAPACITOR (DTC) INTERCONNECT FOR EMBEDDED POWER SUPPLY (EPS)”. With publication no. WO/2026/182924, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10W 44/20

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Disclaimer: Curated by HT Syndication....