INTERNATIONAL PATENT: DAYLIGHT SOLUTIONS, INC. FILES APPLICATION FOR "LASER ASSEMBLY WITH PHOTONIC INTEGRATED CIRCUIT MODULE"

GENEVA, April 15 -- DAYLIGHT SOLUTIONS, INC. (16465 Via Esprillo, Suite 100San Diego, CA 92127) filed a patent application (PCT/US2025/025208) for "LASER ASSEMBLY WITH PHOTONIC INTEGRATED CIRCUIT MODULE" on Apr 17, 2025. With publication no. WO/2026/075691, the details related to the patent application was published on Apr 09, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SCHALCH, Jacob, Springer (c/o Daylight Solutions, Inc.16465 Via Esprillo, Suite 100San Diego, CA 92127), WILLIAMSON, Robert, S., III (c/o Daylight Solutions, Inc.16465 Via Esprillo, Suite 100San Diego, CA 92127), PUSHKARS...