GENEVA, Aug. 14 -- QUALCOMM INCORPORATED filed a patent application (US2025/061009) for “DAM APPLICATION FOR EXPOSED DIE WITH FLAT LID STRUCTURE PACKAGES”. With publication no. WO/2026/169365, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H10W 40/77
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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