INTERNATIONAL PATENT: DAIHEN CORPORATION, 株式会社ダイヘン FILES APPLICATION FOR "ADDITIVE MANUFACTURING SYSTEM AND ADDITIVE MANUFACTURING METHOD"

GENEVA, April 6 -- DAIHEN CORPORATION (1-11, Tagawa 2-chome, Yodogawa-ku, Osaka-shi, Osaka5328512), 株式会社ダイヘン (大阪府大阪市淀川区田川２丁目１番１１号) filed a patent application (PCT/JP2025/030526) for "ADDITIVE MANUFACTURING SYSTEM AND ADDITIVE MANUFACTURING METHOD" on Aug 29, 2025. With publication no. WO/2026/070203, the details related to the patent application was published on Apr 02, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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