GENEVA, March 24 -- DAICEL CORPORATION (3-1, Ofuka-cho, Kita-ku, Osaka-shi, Osaka5300011), 株式会社ダイセル (大阪府大阪市北区大深町３番１号) filed a patent application (PCT/JP2025/030966) for "SINTERABLE BONDING PASTE AND BONDED STRUCTURE" on Sep 02, 2025. With publication no. WO/2026/058762, the details related to the patent application was published on Mar 19, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): UESHIMA, Minoru (c/o DAICEL CORPORATION, 2-18-1...