INTERNATIONAL PATENT: DAICEL CORPORATION, 株式会社ダイセル, THE UNIVERSITY OF OSAKA, 国立大学法人大阪大学 FILES APPLICATION FOR "RESIN MOLDED BODY"

GENEVA, March 10 -- DAICEL CORPORATION (3-1, Ofuka-cho, Kita-ku, Osaka-shi, Osaka5300011), 株式会社ダイセル (大阪府大阪市北区大深町３番１号), THE UNIVERSITY OF OSAKA (1-1, Yamadaoka, Suita-shi, Osaka5650871), 国立大学法人大阪大学 (大阪府吹田市山田丘１番１号) filed a patent application (PCT/JP2025/029839) for "RESIN MOLDED BODY" on Aug 26, 2025. With publication no. WO/2026/048770, the details related to the patent application was published on Mar 05, 2026.

Notably, the...