INTERNATIONAL PATENT: DAICEL CORPORATION, 株式会社ダイセル, HOKKAIDO UNIVERSITY OF SCIENCE, 学校法人北海道科学大学 FILES APPLICATION FOR "CURABLE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED PRODUCT THEREOF"

Posted On: 2026-04-19

GENEVA, April 19 -- DAICEL CORPORATION (3-1, Ofuka-cho, Kita-ku, Osaka-shi, Osaka5300011), 株式会社ダイセル (大阪府大阪市北区大深町３番１号), HOKKAIDO UNIVERSITY OF SCIENCE (7-Jo 15-4-1 Maeda, Teine-ku, Sapporo-shi, Hokkaido0068585), 学校法人北海道科学大学 (北海道札幌市手稲区前田７条１５丁目４番１号) filed a patent application (PCT/JP2025/034618) for "CURABLE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED PRODUCT T...

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INTERNATIONAL PATENT: DAICEL CORPORATION, 株式会社ダイセル, HOKKAIDO UNIVERSITY OF SCIENCE, 学校法人北海道科学大学 FILES APPLICATION FOR "CURABLE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED PRODUCT THEREOF"