GENEVA, Feb. 17 -- DAI NIPPON PRINTING CO., LTD. (1-1, Ichigaya-kaga-cho 1-chome, Shinjuku-ku, Tokyo1628001), 大日本印刷株式会社 (東京都新宿区市谷加賀町一丁目１番１号) filed a patent application (PCT/JP2025/027772) for "WIRING BOARD, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR PACKAGE" on Aug 05, 2025. With publication no. WO/2026/034505, the details related to the patent application was published on Feb 12, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organi...