INTERNATIONAL PATENT: DAI NIPPON PRINTING CO., LTD., 大日本印刷株式会社 FILES APPLICATION FOR "THROUGH-ELECTRODE SUBSTRATE, THROUGH-ELECTRODE SUBSTRATE EQUIPPED WITH ELEMENT, CONNECTION SUBSTRATE AND SEMICONDUCTOR DEVICE"

GENEVA, Feb. 17 -- DAI NIPPON PRINTING CO., LTD. (1-1, Ichigaya-kagacho 1-chome, Shinjuku-ku, Tokyo1628001), 大日本印刷株式会社 (東京都新宿区市谷加賀町一丁目１番１号) filed a patent application (PCT/JP2025/027719) for "THROUGH-ELECTRODE SUBSTRATE, THROUGH-ELECTRODE SUBSTRATE EQUIPPED WITH ELEMENT, CONNECTION SUBSTRATE, AND SEMICONDUCTOR DEVICE" on Aug 05, 2025. With publication no. WO/2026/034489, the details related to the patent application was published on Feb 12, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, whi...