INTERNATIONAL PATENT: CXMT CORPORATION, 长鑫科技集团股份有限公司 FILES APPLICATION FOR "SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGING STRUCTURE"

GENEVA, May 3 -- CXMT CORPORATION (No. 388, Xingye Avenue, Airport Industrial Park, Economic and Technological Development AreaHefei, Anhui 230601), 长鑫科技集团股份有限公司 (中国安徽省合肥市经济技术开发区空港工业园兴业大道388号) filed a patent application (PCT/CN2025/084340) for "SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGING STRUCTURE" on Mar 24, 2025. With publication no. WO/2026/086095, the details related to the patent application was published on Apr 30, 2026.

Notably, the patent application was submitted under the ...