International Patent: CURING FUNCTION EXPRESSING PASTE, ADHESIVE, SEALING MATERIAL, COATING AGENT, CURED PRODUCT, SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, AND CURING, BONDING, SEALING, AND COATING METHOD USING CURING FUNCTION EXPRESSING PASTE

GENEVA, July 27 -- NAMICS CORPORATION filed a patent application (JP2026/000955) for “CURING FUNCTION EXPRESSING PASTE, ADHESIVE, SEALING MATERIAL, COATING AGENT, CURED PRODUCT, SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, AND CURING, BONDING, SEALING, AND COATING METHOD USING CURING FUNCTION EXPRESSING PASTE”. With publication no. WO/2026/155180, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: C08L 101/00

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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