GENEVA, July 6 -- DIC CORPORATION filed a patent application (JP2025/038247) for “CURABLE RESIN, METHOD FOR PRODUCING CURABLE RESIN, CURABLE COMPOSITION, CURED PRODUCT, PREPREG, CIRCUIT BOARD, BUILD-UP FILM, SEMICONDUCTOR SEALING MATERIAL, AND SEMICONDUCTOR DEVICE”. With publication no. WO/2026/140497, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C08G 61/02
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....