International Patent: CURABLE FUNCTIONAL PASTE, ADHESIVE, SEALING MATERIAL, COATING AGENT, CURED PRODUCT, SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, AND CURING, ADHERING, SEALING, AND COATING METHODS USING CURABLE FUNCTIONAL PASTE

GENEVA, July 27 -- NAMICS CORPORATION filed a patent application (JP2026/000953) for “CURABLE FUNCTIONAL PASTE, ADHESIVE, SEALING MATERIAL, COATING AGENT, CURED PRODUCT, SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, AND CURING, ADHERING, SEALING, AND COATING METHODS USING CURABLE FUNCTIONAL PASTE”. With publication no. WO/2026/155178, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: C08L 101/00

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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