GENEVA, Aug. 14 -- RESONAC CORPORATION filed a patent application (JP2026/003855) for “CURABLE COMPOSITION FOR SEALING MATERIAL, AND SEALING MATERIAL”. With publication no. WO/2026/168449, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C08F 2/44
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....