International Patent: COUPLING DEVICE FOR A MODULAR ROBOT, COUPLING UNIT, MODULE FOR A MODULAR ROBOT, MODULAR ROBOT AND METHOD FOR AT LEAST PARTIALLY ASSEMBLING A MODULAR ROBOT

GENEVA, Aug. 7 -- ROBCO GMBH filed a patent application (EP2026/052665) for “COUPLING DEVICE FOR A MODULAR ROBOT, COUPLING UNIT, MODULE FOR A MODULAR ROBOT, MODULAR ROBOT AND METHOD FOR AT LEAST PARTIALLY ASSEMBLING A MODULAR ROBOT”. With publication no. WO/2026/162821, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: B25J 9/08

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Disclaimer: Curated by HT Syndication....