GENEVA, July 2 -- LANSUS TECHNOLOGIES INC. filed a patent application (CN2025/138611) for “COUPLER AND RADIO FREQUENCY CHIP”. With publication no. WO/2026/130081, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H01P 5/16
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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