GENEVA, Oct. 30 -- HERAEUS MATERIALS SINGAPORE PTE. LTD. filed a patent application (CN2025/090604) for “COPPER SINTERING PASTE AND USE THEREOF FOR CONNECTING ELECTRONIC COMPONENTS”. With publication no. WO/2026/222674, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: B22F 1/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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