GENEVA, Sept. 7 -- MITSUI KINZOKU COMPANY, LIMITED filed a patent application (JP2026/006310) for “COPPER POWDER FOR ADDITIVE MANUFACTURING, ADDITIVELY MANUFACTURED ARTICLE, SINTERED BODY, AND METHOD FOR PRODUCING SAME”. With publication no. WO/2026/181929, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: B22F 1/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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