GENEVA, Aug. 14 -- FURUKAWA CHEMICALS CO., LTD. filed a patent application (JP2026/003242) for “COPPER POWDER, FLAT COPPER POWDER, CONDUCTIVE PASTE, AND METHOD FOR PRODUCING FLAT COPPER POWDER”. With publication no. WO/2026/168302, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: B22F 1/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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