GENEVA, Oct. 30 -- HUA HONG SEMICONDUCTOR MANUFACTURING (WUXI) LIMITED filed a patent application (CN2025/106634) for “COPPER INTERCONNECT STRUCTURE AND FORMING METHOD THEREFOR”. With publication no. WO/2026/222900, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H10W 20/45
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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