International Patent: COPPER-COATED RESIN PARTICLES AND FILLER-CONTAINING PASTE

GENEVA, Sept. 18 -- MITSUBISHI MATERIALS ELECTRONIC CHEMICALS CO., LTD. filed a patent application (JP2026/003990) for “COPPER-COATED RESIN PARTICLES AND FILLER-CONTAINING PASTE”. With publication no. WO/2026/186374, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: C23C 18/40

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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