International Patent: COPPER-BASED PLATE MATERIAL, AND HEAT DISSIPATION SUBSTRATE, BUS BAR, RECTANGULAR WIRE, AND ROUND WIRE EACH USING SAME

GENEVA, July 6 -- FURUKAWA ELECTRIC CO., LTD. filed a patent application (JP2025/045692) for “COPPER-BASED PLATE MATERIAL, AND HEAT DISSIPATION SUBSTRATE, BUS BAR, RECTANGULAR WIRE, AND ROUND WIRE EACH USING SAME”. With publication no. WO/2026/141597, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: C22C 9/00

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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