GENEVA, July 18 -- APPLIED MATERIALS, INC. filed a patent application (US2025/010733) for “CONTROLLED ETCHING USING PULSED PLASMA”. With publication no. WO/2026/151429, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H01J 37/32
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....