GENEVA, Oct. 9 -- HARMAN INTERNATIONAL INDUSTRIES , INCORPORATED filed a patent application (CN2025/086352) for “CONNECTOR ASSEMBLY AND SYSTEM HAVING THE CONNECTOR ASSEMBLY”. With publication no. WO/2026/207713, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: G06F 13/40

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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