International Patent: CONDUCTIVE PASTE, RFID INLAY, AND RFID INLAY PRODUCTION METHOD

GENEVA, July 27 -- SEKISUI CHEMICAL CO., LTD. filed a patent application (JP2026/000899) for “CONDUCTIVE PASTE, RFID INLAY, AND RFID INLAY PRODUCTION METHOD”. With publication no. WO/2026/155164, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H01B 1/22

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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