International Patent: COMPOUND, MOLDED ITEM, CURED PRODUCT OF COMPOUND, MAGNETIC CORE, AND COIL COMPONENT

GENEVA, Oct. 9 -- RESONAC CORPORATION filed a patent application (JP2026/012474) for “COMPOUND, MOLDED ITEM, CURED PRODUCT OF COMPOUND, MAGNETIC CORE, AND COIL COMPONENT”. With publication no. WO/2026/211579, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H01F 1/28

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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