International Patent: COMPOUND, MOLDED BODY, CURED PRODUCT OF COMPOUND, MAGNETIC CORE, AND COIL COMPONENT

GENEVA, Aug. 31 -- RESONAC CORPORATION filed a patent application (JP2026/004638) for “COMPOUND, MOLDED BODY, CURED PRODUCT OF COMPOUND, MAGNETIC CORE, AND COIL COMPONENT”. With publication no. WO/2026/176990, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: C08L 63/00

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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