International Patent: COMPOSITION FOR FOAM MOLDING, FOAM MOLDED BODY, FOAMED ELECTRIC WIRE, METHOD FOR PRODUCING FOAM MOLDED BODY, AND METHOD FOR PRODUCING FOAMED ELECTRIC WIRE

GENEVA, Aug. 21 -- DAIKIN INDUSTRIES, LTD. filed a patent application (JP2026/005043) for “COMPOSITION FOR FOAM MOLDING, FOAM MOLDED BODY, FOAMED ELECTRIC WIRE, METHOD FOR PRODUCING FOAM MOLDED BODY, AND METHOD FOR PRODUCING FOAMED ELECTRIC WIRE”. With publication no. WO/2026/173023, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: C08J 9/04

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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