International Patent: COMPOSITE WIRING BOARD, ELECTRONIC MODULE, AND ELECTRONIC DEVICE

GENEVA, July 31 -- KYOCERA CORPORATION filed a patent application (JP2026/000877) for “COMPOSITE WIRING BOARD, ELECTRONIC MODULE, AND ELECTRONIC DEVICE”. With publication no. WO/2026/160219, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10W 74/10

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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