GENEVA, July 9 -- SHENZHEN HFC CO., LTD. filed a patent application (CN2025/081903) for “COMPOSITE THERMAL PAD AND PREPARATION METHOD THEREFOR, AND HEAT DISSIPATION DEVICE”. With publication no. WO/2026/143859, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: B32B 9/04
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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