GENEVA, July 2 -- RESONAC CORPORATION filed a patent application (JP2025/042742) for “COMPONENT WITH SOLDER BUMPS, MOUNTING PRECURSOR, AND METHOD FOR MANUFACTURING MOUNTING BODY”. With publication no. WO/2026/134021, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H01L 21/60
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....