GENEVA, June 26 -- UENO SEIKI CO.,LTD. filed a patent application (JP2025/041696) for “COMPONENT PROCESSING DEVICE”. With publication no. WO/2026/121164, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H01L 21/52
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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