GENEVA, April 5 -- COLOPLAST A/S (Holtedam 13050 Humlebaek) filed a patent application (PCT/DK2025/050171) for "AN ADHESIVE WAFER WITH GEL-FORMING LAYER" on Sep 30, 2025. With publication no. WO/2026/067950, the details related to the patent application was published on Apr 02, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): HOEJ, Nicolaj (Holtedam 13050 Humlebaek), STROEBECH, Esben (Holtedam 13050 Humlebaek)
Abstract: An adhesive wafer is provided for securing an ostomy device to the skin of a patient. When the adhesive wafer is exposed to moisture - a second gel-forming layer has a swelli...