GENEVA, Aug. 14 -- QUALCOMM INCORPORATED filed a patent application (US2026/013021) for “COLLISION HANDLING FOR SUB-BAND FULL DUPLEX SETS OF SYMBOLS”. With publication no. WO/2026/169494, here are the other details related to the patent application:
Kind: Initial Publication without ISR [A2]
IPC: H04L 1/1867
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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