GENEVA, July 31 -- LSP INNOVATIONS LLP filed a patent application (IN2025/052159) for “COLD-CUM-COLD-PROOF PANELS, ACCESSORIES AND USES THEREOF”. With publication no. WO/2026/159725, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: E04F 13/075
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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