International Patent: COAXIAL TEST SOCKET AND PRINTED CIRCUIT BOARD INTERFACES FOR TESTING INTEGRATED CIRCUIT CHIPS

GENEVA, Oct. 5 -- SMITHS INTERCONNECT AMERICAS, INC. filed a patent application (US2026/020492) for “COAXIAL TEST SOCKET AND PRINTED CIRCUIT BOARD INTERFACES FOR TESTING INTEGRATED CIRCUIT CHIPS”. With publication no. WO/2026/206914, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: G01R 31/28

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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