International Patent: CIRCUITS AND METHODS FOR TRANSMITTING DATA OVER 3D SEMICONDUCTOR DIE INTERCONNECTS

GENEVA, July 31 -- BLUE CHEETAH ANALOG DESIGN, INC. filed a patent application (US2026/011745) for “CIRCUITS AND METHODS FOR TRANSMITTING DATA OVER 3D SEMICONDUCTOR DIE INTERCONNECTS”. With publication no. WO/2026/161322, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: G06F 1/10

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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