International Patent: CIRCUIT SUBSTRATE, ELECTRONIC COMPONENT, POWER SUPPLY ASSEMBLY, AND VEHICLE

GENEVA, July 1 -- BYD COMPANY LIMITED filed a patent application (CN2025/120134) for “CIRCUIT SUBSTRATE, ELECTRONIC COMPONENT, POWER SUPPLY ASSEMBLY, AND VEHICLE”. With publication no. WO/2026/123839, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H05K 1/02

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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