International Patent: CHIP-TO-MODULE CABLE ASSEMBLY AND CIRCUIT BOARD ASSEMBLY

GENEVA, Sept. 18 -- FUZHOU GAOXINQU MICAS NETWORK TECHNOLOGY CO., LTD. filed a patent application (CN2026/076805) for “CHIP-TO-MODULE CABLE ASSEMBLY AND CIRCUIT BOARD ASSEMBLY”. With publication no. WO/2026/184345, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H01R 12/77

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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