International Patent: CHIP STRUCTURE AND PREPARATION METHOD THEREFOR

GENEVA, July 27 -- PEKING UNIVERSITY filed a patent application (CN2025/136278) for “CHIP STRUCTURE AND PREPARATION METHOD THEREFOR”. With publication no. WO/2026/152873, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10W 20/40

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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