GENEVA, July 1 -- SHENNAN CIRCUITS CO.,LTD. filed a patent application (CN2025/089650) for “CHIP PACKAGE”. With publication no. WO/2026/123527, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H01L 23/538
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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