International Patent: CHIP PACKAGE WITH AN INTERPOSER HAVING A GLASS CORE AND A SUBSTRATE HAVING A GLASS CORE

GENEVA, July 2 -- ADVANCED MICRO DEVICES, INC. filed a patent application (US2025/050821) for “CHIP PACKAGE WITH AN INTERPOSER HAVING A GLASS CORE AND A SUBSTRATE HAVING A GLASS CORE”. With publication no. WO/2026/135798, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10W 70/00

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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