International Patent: CHIP PACKAGE DESIGN OPTIMIZATION METHOD AND APPARATUS, STORAGE MEDIUM, AND ELECTRONIC DEVICE

GENEVA, June 26 -- INTERNATIONAL INNOVATION CENTER OF TSINGHUA UNIVERSITY, SHANGHAI filed a patent application (CN2025/073640) for “CHIP PACKAGE DESIGN OPTIMIZATION METHOD AND APPARATUS, STORAGE MEDIUM, AND ELECTRONIC DEVICE”. With publication no. WO/2026/118164, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: G06F 30/394

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Disclaimer: Curated by HT Syndication....