International Patent: CHIP MODULE, ELECTRONIC DEVICE, AND MANUFACTURING METHOD FOR CHIP MODULE

GENEVA, Oct. 30 -- DBVISION (NINGBO) COMMUNICATION TECHNOLOGY CO., LTD. filed a patent application (CN2026/080949) for “CHIP MODULE, ELECTRONIC DEVICE, AND MANUFACTURING METHOD FOR CHIP MODULE”. With publication no. WO/2026/223228, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10W 70/40

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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